| Tru-Form's
special rework and repair service is dedicated to providing
a quality service to recognised IPC standards.
 |
-
IPC A 610 class 1, 2,3. Workmanship standards and
acceptability of electronic assemblies.
-
IPC 7711 Rework of electronic assemblies
- IPC
7721 Repair and modification of PCB and electronic
assemblies.
|
Automated
removal and replacement of components BGA, Micro BGA, Flip
Chip. Plus majority of fine pitch components handled.
Tru-Form’s
specialist rework service is enhanced by the in-house capability
to X-Ray inspect a variety of electronic components.
X-RAY
inspection of PCB assembly

X-Ray
inspection includes component such as: BGA CSP Encapsulated
devices
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